Packaging

David L. Huffman

The latest SCA (CAL4B) die are packaged in 68-pin PLCC 'Plastic Leaded Chip Carrier'

There are two package types, UP and DOWN allowing the chips to be used on each side of a printed circuit board sharing pinout.

The units pair in this manner

Bonding diagram for Up and Down configuration

Die-up is also called cavity-up. Die-down is also called cavity-down packaging.






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