David L. Huffman
The latest SCA (CAL4B) die are packaged in 68-pin PLCC 'Plastic Leaded Chip Carrier'
There are two package types, UP and DOWN allowing the chips to be used on each
side of a printed circuit board sharing pinout.
Bonding diagram for Up and Down configuration
Die-up is also called cavity-up. Die-down is also called cavity-down packaging.