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This page contains current information regarding
the design of the vacuum system for the pixel detector and the beam pipe. Links to web pages and other topics are also shown.
Vacuum system for the Pixel Detector
Analysis of Pixel Vacuum System
The
original design of the pixel detector consisted of the pixel substrates being
moved in the horizontal position. The
design included thin membrane, also used as a RF-shield, that divided the
vacuum vessel into two vacuum regions.
The purpose of the membrane was to isolate vacuum pressure of the beam
line from the vacuum pressure of the pixel detector. The membrane did have a small gap so as to allow a restrictive
flow between the two chambers. An
analysis of the conductance between the beam line (“clean”) region and the
pixel (“dirty”) region was completed.
The analysis showed that, in actuality, the gap in the membrane was so
large that the pressures in the two chambers were equal. The required pressure in the beam line
vacuum chamber is 1e-7 torr. With the
expected gas load from the pixel detector to be on the order of 0.01
torr-L/sec, the beam vacuum will not be low enough. A detailed report is posted on the BTeV Document
Database as Btev-doc-318-v1. (password required) (21 November 2001)
The
design of the pixel detector was modified to completely isolate the beam line
vacuum from the pixel vacuum. To move
the pixel detector with a leak-tight RF shield, a bellows is added to the
design. To accommodate the space taken
up by the bellows, the pixel substrate would be moved in the vertical
position. To achieve a beam line vacuum
pressure of 1e-7 torr in the new design, it is proposed that the pumping speed
be increased by coating the side walls of the vacuum vessel with a NEG
material, like Ti-Zr-V. The required
outgassing rate of the surfaces in the beam line volume is on the order of
1e-10 torr-L/sec-cm^2. (28 January
2002) – pdf file
A
5% model of the pixel detector was built and its gas load measured. The results are
explained elsewhere on this web page.
One lesson that can be applied to the design of the vacuum system is the
use of a cryopump. When the heat
sink/cable support is cooled with liquid nitrogen, the heat sink acts as a
cryopump that pumps water at a rate of 10,000’s L/sec. The pressure is reduced to less than 1e-7
torr. As a result, the need for a
vacuum-tight RF shield and the big bellows is gone and the pixel vacuum vessel
can be one vacuum region. This opens up
the option of having the pixel detector move either horizontally or vertically. Most importantly, the cryopump temperature
does not affect the temperature of the substrates. This has been presented to the collaboration and is posted on the
BTeV Document
Database as BTeV-doc-813 (password required). (2 July 2002)
The
effects of cold temperature on the carbon shell has been documented and shown
to not affect the alignment of the pixels.
Thus, the LN2-cooled cryopanel has been incorporated into the design of
the detector in order to pump water vapor.
Two cryopanels, one on the top surface of the vessel, one on the bottom,
will be used. In addition, liquid
nitrogen will be used as part of the temperature control system for the
pixels. A secondary benefit of the
temperature control system is that the surfaces that are cooled by liquid
nitrogen act as cryopumps. Also, the
strain relief structure for the cables, essentially a set of aluminum ribs, are
thermally connected to the liquid nitrogen cooled surfaces. Through thermal conductivity, the strain
relief structure is an added cryopump.
The total pumping speed of water vapor due to all of the liquid nitrogen
cooled surfaces is 290,000 L/sec. A
liquid helium cryopump system is added to the vacuum system in order to pump
non-condensable gases such as nitrogen (7500 L/sec) and hydrogen (2000
L/sec). The conceptual design has been
presented to the collaboration, with documentation posted on the BTeV Document
Database as BTeV-doc-2005 (password required). (3 October 2003)
The
heat sink (cryopanel), acting as a cryopump, is likely to have some ice
build-up during the operation of the detector.
Over a year’s time, the cryopanel will have a conservatively estimated
frost build-up of 0.22 mm thick. The
frost at this thickness should not affect the performance of the
cryopanel. An analysis is provided. (27 September 2002)
Measured
gas load from 5% model of pixel detector
An assembly simulating
5% of the pixel detector, including 6 pixel stations, its carbon support, and
aluminum heat sink/cable support, is built and its outgassing rate
measured. The gas load of the 5% model
is 5e-4 torr at room temperature. When
the heat sink is cooled to –160 deg C and the substrates are not cooled, the
pressure in the vacuum chamber was as low as 9e-9 torr. The substrate temperature was 20 deg C. The results have been presented and are
found in the BTeV
Document Database (password required):
·
Talk on the results – Document 767 (17 June 2002)
·
Detailed report, including calibration, analysis,
and results – Document 812 (21 June 2002)
The gas load was
measured using the variable conductance method (15 January 2002) (pdf file).
Photo and drawing
gallery (2 July 2002)
·
5% model – jpg file
·
Model being placed inside vacuum chamber – pdf file
·
Vacuum chamber (photos and PID) – pdf file
Estimated & measured gas load from
individual material outgassing of the pixel detector
The total gas load of
following materials was measured using the rate-of-rise method over 150-250
hours (29 July 2002):
·
Fuzzy carbon, Pocofoam, carbon-carbon, and
Pyrolytic Graphite Sheet (PGS):
candidates for the pixel substrates (pdf
file)
·
Outgassing rates, calculated by the surface area
of the overall volume (pdf file)
·
Bump-bonded chips, a manifold of glassy carbon
fiber cooling tubes, kapton HDI, G-10 circuit boards, and carbon fiber panels (pdf file)
·
Outgassing rates, calculated by the surface area
of the overall volume (pdf file)
·
An assembly of a 5-chip module, a kapton tail, and
a glass slide, held together with 3M 9882 tape and Emerson & Cuming Stycast
2850FT/Catalyst 24LV epoxy (pdf file)
·
The empty stainless steel vacuum chamber after the
material was removed from the chamber (pdf file). (13 March 2002)
RGA readings of the chip
module/kapton/glass slide assembly were taken at different times of the test (pdf file). (28
February 2002)
There are a few
conclusions that can be drawn from the gas load measurements:
·
Pocofoam shows the lowest gas load due to
outgassing when compared to the other substrate candidates.
·
The gas load of the bump-bonded chips is not
significantly higher than the gas load in the empty vacuum chamber.
·
The highest gas load comes from the G-10 circuit
boards, which include components that were soldered on to the board.
·
The assembled module/kapton tail/glass slide
starts off with a high gas load but is reduced to one of the lowest gas
load. Note that air bubbles exists in
the epoxy, as seen through the glass slide.
The total gas load was
calculated using the outgassing rate of each material in the pixel detector
that is found in literature. The total
gas load is estimated at 1.36e-2 torr-L/sec inside the pixel membrane. (27 February 2002) – pdf
file
Outgassing rate and gas
load test setup and
procedure
Outgassing
rates references are shown. The
widely varied measurements are indicative of the gas load’s dependence on
material, surface treatment, temperature, and pump time (16 January 2002).
Simulated
Pressure Distribution in Vacuum System
A model simulates the
pressure distribution in the BTeV vacuum system. Included in the model are the 1.92 inch diameter RICH beam pipes,
the 1.00 inch diameter forward beam pipe, the vacuum chamber containing the pixel
detector, 80 L/sec ion pumps at the ends of the RICH beam pipes, a 50 L/sec
pump at the vacuum chamber (“clean side”), an 800 L/sec pump in the pixel
detector volume (“dirty side”). A thin
aluminum RF shield separates the volumes into the clean and dirty sides. An aperture of 0.5 cm diameter through the
shield is also modeled. An estimated
gas load in the dirty side of 1.36e-2 torr-L/sec was used in the model. The outgassing rate of the beam pipes and
the clean side is 1e-10 torr-L/cm^2/sec.
The
current outgassing rate measurements indicate that the actual gas load inside
the pixel membrane can be as low as 1.50e-3 torr-L/sec. A model of the vacuum system with the lower
gas load was simulated. The resulting
pressure distribution is shown (7 Nov 2001) –pdf
file
For comparison, the pressure distribution is shown for when the beam pipe outgassing rate is 1e-14 torr-L/cm^2/sec (9 November 2001) –pdf file
End Window for Vacuum Vessel – ps file, jpg file (13 July 2001)
Formed
head: An
aluminum formed head has been designed following the guidelines in the ASME
Boiler and Pressure Vessel Code. The
head thickness of 0.023 inch (0.58 mm) is the required thickness according to
the Code for a head diameter of 20 inches (508 mm). The head profile is elliptical with about a 2:1 ratio for the
diameters. It will be determined how to
best fabricate a uniformly thin-walled aluminum head with such large
diameter. An analysis was performed
with the structure under an internal pressure of 14.7 psi. The safety factor for the design is three
times the yields stress of aluminum (ps file, jpg file). The
maximum deflection is 0.024 inch (0.61 mm) (ps file, jpg file). The
transition to the beam pipe has a radius of 0.1 inch. When the front of the head sits at z=65 cm from C0, the largest
thickness through which a particle travels is 0.036 inch (0.91 mm) (ps file, jpg file)
Flange: The current flange design is for a metal
wire seal. Research and analysis must
take place to understand the best available option to seal the window to the
vacuum vessel and how to fabricate the custom-made flange.
Research has shown that the outgassing rate of
material varies with cleaning techniques.
A proven method to degas a vacuum chamber is to bake it at temperatures
greater than 150 degrees Celsius.
However, the silicon in the BTeV Vertex Detector cannot withstand
temperatures greater than 80 degrees Celsius.
Thus, methods are being investigated to degas the beamline vacuum
without elevated temperatures.
A
test is being run to understand how well low-temperature bake-outs can degass a
vacuum chamber. A chamber that is 6
liters in volume is heated at various temperatures between 50 and 150 degrees
Celsius. Its outgassing rate is
measured using the rate-of-rise method after a 24 hour bake-out and cool
down. RGA readings are also recorded of
the cleaned chamber. The current test results
are shown (pdf file). (13 March 2002)
The effects of cold
temperature on the performance of a prototype power flex cable and signal flex
cable are being tested. Photos of the
test setup are shown (pdf file). The flex cables are immersed in liquid nitrogen
and flexed repeatedly. 10 mA runs
through the signal cable, and 1 A runs through the power cable. The current and voltage are recorded. The cables are positioned so that there is a
2.5-cm bend radius when the supports are 2-cm apart. The supports slide apart a maximum distance of 4-cm. (23 August 2002)
Photo of a complete cold
block assembly (jpg file). This device will be used to record thermal
distribution and LN2 flow characteristics.
The entire assembly is 1.3-m long.
There are 30 copper blocks that
are each 4cm x 4cm x 0.6cm. The copper
blocks span a total distance of 1.2-m (centerline of block 1 to centerline of
block 30). The blocks are brazed to a
stainless steel tube 1.6-cm (0.62-inch) diameter (sectioned
view). (27 January 2004)
Photos of cold block
assembly – details of test setup (jpg files):
o
Photo 1: One heater clamped to each tab of cold block
assembly. 150W, 120V cartridge heater
is used.
o
Photo 2: End view of cold block assembly with heaters
clamped to tabs.
o
Photo 3: Top view of cold block assembly with heaters
clamped to tabs.
Design
requirements (updated 17 September 2002) –pdf file
The beam pipe system
extends from the end of the pixel detector to the low beta quads. There are several components making up the
system. This table (ps
file, jpg file) lists the layout of the
components in terms of the location from C0.
(15 October 2001)
An assembly drawing of
the beam pipe assembly from the end of the pixel detector to the ion pump
(z=8m) is posted on the BTeV Document
Database as Btev-doc-322-v1 (password required) (4 April 2002).
The transition of the
forward beam pipe to the RICH beam pipe is a low-mass flange. The analysis of the design is posted (pdf file) (20 May 2002).
Comparison
of forward beam pipe configurations (table
updated 14 September 2001) – ps file, jpg file
In order to meet the
design requirement of a minimum clear line-of-sight, the forward beam pipe must
be supported at the location of z=125 inches (317 cm) from C0. The calculations for this conclusion is
shown (pdf file). (18 September 2002)
Straightness
of 0.008-inch wall, 1.0-inch inner diameter aluminum tube
6061-T6 aluminum tubes
were manufactured so that the wall thickness was nominally 0.008-inch and the
inner diameter nominally 1.0-inch. The
drawn tube lengths varied from 31 to 120 inches. As a potential BTeV forward beam pipe, the straightness of the
longest tube is adequate for a clear line-of-sight for the beam to pass through
if the tube is supported along its length.
A detailed report documents the measurements (3 April 2002) - pdf file
Comparison of RICH beam pipe configurations (table updated 31
August 2001) – ps file, jpg
file
The CDF Run I beam pipe
can be modified so that it can be used as the beam pipe through the RICH
detector. The two-inch diameter
beryllium part of the pipe is about 244 inches long. The wall thickness is 0.020”.
Drawings of the CDF pipe and the BTeV RICH beam pipe are posted on BTeV Document
Database as Btev-doc-323-v1 (password required). (4 April 2002)
Joe Howell's B-Tev Mechanical Design Web
Page
Fermilab - Particle Physics Division
– Mechanical Support Department
NuMI Carrier
and Pre-Target Tunnel – Magnet Transport System Web Page
Pressure Accumulation inside
CDF-CLC photomultiplier tubes due to Helium Permeation (2 April 2002) – pdf file
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